PROJECT SERVICE

• System chassis design and prototyping
• System level thermal simulation and analysis
• Passive thermal solutions design and development
• Active thermal solutions design and development
• 3D high performance heat sink design optimization

SOLUTIONS
(PATENT GRANTED IN TAIWAN, JAPAN US and EU)

• Create high performance 3D fan-less, heat pipe-less heat sink design to reduce system noise to a minimum level.
• Architect such 3D design as a platform to facilitate the heat dissipation needs of high power density chip or other industrial applications.
• Provide heat pipe less ,air cooling design to solve high power density chip thermal issue and other energy industrial applications.
• Develop unique tools to make the 3D unique heat sink design a reality that can have a mass production capability.
• Create an innovative bonding technology to bond different metals together to be used as a substrate in our proprietary 3D heat sink design.
• Create an industry benchmark of price performance ratio in high power solutions.

COMPETITION

• There’s currently no other similar designs or products available in the market.
• Our design and development takes the current performance of conduction and convection cooling to a new level.
• Our proprietary tools used to mass produce our 3D unique heat sink designs and thermal solutions are a trade secret which will not be disclosed.
• Optimized heat dissipation surface of GIL 3D heat sink is 3 5 times more areas than any of the traditional heat sink design given the same volume space.
• Already set a benchmark versus the top passive CPU cooler Noctua NH P1 designed and developed by Austria thermal solution provider.
• Our intellectual properties can be applied to all industries to save energy and reduce carbon emission especially in the high heat flux applications.
• The GIL company takes the initiatives to become an ESG driven facility to comply with Environmental, Social, and Governance criteria.

CPU COOLER PROBLEM/CHALLENGES
AI DATA CENTER CPU/ GPU NPU /AI HIGH POWER CHIP ISSUES

The Strange Attractor Effect

The current high computing power CPU and GPU demand a blowing fan with heat pipes and heat sink integrated solution or a water cooling device to resolve high power density thermal issues. It creates high noises and reliability problems in the PC, Workstation, Servers, etc. The marketplace has not been able to address this problem and need of reducing noise levels and improving the reliability of high computing power devices and/or systems applications.

• All the CPU /GPU cooling fans create very unpleasant user experiences.
• Water cooling creates a lot of reliability problems, which is costly to fix.
• The current computing industry has not been able to solve both noise and reliability problems at the same time.