Green Innovation Living Inc. Announces Breakthrough Air-Cooled Thermal Module to Challenge Liquid Cooling in High-Power Server Systems – “Make Impossible a Possible”
Date: July 15, 2025
Locations: Taipei • Los Angeles • Tokyo • EU • China
Green Innovation Living Inc. today announced a groundbreaking advancement in thermal engineering: an air-cooled thermal module capable of replacing traditional liquid cooling in high-power computing environments. Engineered for use in 1U and 2U servers, this solution manages heat loads of up to 700W (1U) and 1200W (2U) — performance levels once thought to require liquid cooling.
This revolutionary module introduces a completely reimagined heat sink architecture, shattering long-held conventions in fin structure. Leveraging optimized 3D airflow dynamics, it delivers quiet, efficient, and leak-free cooling with a system-level delta T below 5°C — a level of thermal performance previously deemed unachievable with air cooling alone.
Key Technical Highlights
- Thermal resistance: 0.030 °C/W tested under 1000W simulated heat load
- Target components: Direct cooling for high-flux chips including GPU, CPU, and ASIC
- Passive design: No pumps, no liquids, no leakage — fully air-based solution
- Core technology: 6mm vapor chamber and proprietary 3D fin-stack geometry
- Airflow support: Engineered for 180–250 CFM airflow in standard rack environments
- Thermal delta: Maintains <5°C between heat source and cooling fins
- Noise level: Low-noise, low-maintenance alternative to liquid systems
”‘Make Impossible a Possible’ is not just a slogan — it’s our commitment to redefining what air cooling can achieve,”
said S.Y. Chen, CEO of Green Innovation Living Inc.
“This innovation bridges the performance gap between air and liquid cooling while delivering cost savings, ease of service, and enhanced reliability. It empowers the next generation of AI, HPC, and edge systems to scale with simplicity and sustainability.”
Ideal Applications
- High-power GPUs (e.g., NVIDIA B200), CPUs, and ASICs in the 700–1200W range
- 1U and 2U AI/HPC data center servers
- Edge computing modules and distributed systems
- Mid-to-high-density racks as a liquid cooling alternative
- EV fast-charging station cooling infrastructure
- Refrigeration and HVAC efficiency enhancements
- Thermal exchange systems across the energy sector for the next 20 years
Availability & Partnership Opportunities
The air-cooled thermal module is currently entering pilot integration and is available for evaluation by OEM/ODM partners and data center system integrators. Custom adaptations for large-scale deployments are supported.
Strategic investors and partners are invited to join us in transforming the future of high-efficiency thermal design.
Contact Information
S.Y. Chen
CEO, Green Innovation Living Inc.
Email: shyi@gilivings.com | sychen313@gmail.com
TEL: US: +1 (909) 206-8995 | Taiwan: +886 919-273-975
Website: www.gilivings.com