GIL DEMONSTRATED 3D PASSIVE HEAT SINK DESIGN AND DEVELOPMENT IN HIGH POWER CPU COOLER

• Already took three years to develop a fabrication tooling to try the world benchmark 3D heat sink design with patented structures which will lead the next generation thermal solution on CPU /GPU/LED chip.
• Already finished the first passive thermal solution prototype without fan and heat pipe which the current result outpaced all the existing CPU cooler product in the market by 30-55% more efficiency.
• It’s demonstrated that the future heat exchanger by applying our unique solution will lead to a 40-60% carbon reduction comparing to the current industrial application on air cooling or liquid cooling devices.